A clustered yield model for SMT boards and MCM's Tegethoff, Mick M. V. ; Chen, Tom W. This paper describes a clustered yield model for complex surface mount technology (SMT) assemblies and multichip modules (MCM's). Based on yield modeling techniques that have been proven in the manufacturing of integrated circuits (IC's), this model uses the negative binomial distribution of defects to calculate board yield after test. Manufacturing data validates that this model accurately predicts the clustering of defects and the yield predictions are significantly better than traditional binomial models. Colorado State University. Libraries 1995 text ; image application/pdf ECEtwc00002.pdf FACFECEN100583ARTI eng c1995 IEEE
A clustered yield model for SMT boards and MCM's
Tegethoff, Mick M. V. ; Chen, Tom W.
This paper describes a clustered yield model for complex surface mount technology (SMT) assemblies and multichip modules (MCM's). Based on yield modeling techniques that have been proven in the manufacturing of integrated circuits (IC's), this model uses the negative binomial distribution of defects to calculate board yield after test. Manufacturing data validates that this model accurately predicts the clustering of defects and the yield predictions are significantly better than traditional binomial models.
Colorado State University. Libraries
1995
text ; image
application/pdf
ECEtwc00002.pdf
FACFECEN100583ARTI
eng
c1995 IEEE