Sensitivity analysis of critical parameters in board test Tegethoff, Mick M. V. ; Chen, Tom W. The authors analyze the main contributors to the quality and cost of complex boards. With manufacturing data from Hewlett-Packard boards, they use simulation models to derive the sensitivity of quality and cost to the solder defect rate, the functional defect rate, and test coverage. They also give a simple cost estimate of implementing IEEE 1149.1 boundary scan on ASICs. Their new yield model, which accounts for solder defect clustering, provides highly accurate yield predictions. Colorado State University. Libraries 1996 text ; image application/pdf ECEtwc00001.pdf FACFECEN100582ARTI eng c1996 IEEE
Sensitivity analysis of critical parameters in board test
Tegethoff, Mick M. V. ; Chen, Tom W.
The authors analyze the main contributors to the quality and cost of complex boards. With manufacturing data from Hewlett-Packard boards, they use simulation models to derive the sensitivity of quality and cost to the solder defect rate, the functional defect rate, and test coverage. They also give a simple cost estimate of implementing IEEE 1149.1 boundary scan on ASICs. Their new yield model, which accounts for solder defect clustering, provides highly accurate yield predictions.
Colorado State University. Libraries
1996
text ; image
application/pdf
ECEtwc00001.pdf
FACFECEN100582ARTI
eng
c1996 IEEE